High-soy content dough receives patent

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International patent for a cohesive machine-workable dough with a
high soy content, and products made from the dough.

Deborah W. Cohen received an international patent (#200187086) recently for a cohesive machine-workable dough with a high soy content, and products made from the dough.

The dough comprises a soy component, a pre-gelatinised starch component, a liquid component and optionally other ingredients.

Preferably, the soy component comprises from about 60 to 90 per cent of the dry ingredients, the pre-gelatinised starch component comprises from about 10 to 40 per cent of the dry ingredients and water comprises from about 25 to 45 per cent of the total dough.

The dough may be sheeted, cut and baked to produce foods such as flatbreads, crackers, chips and other snack and bread products of various cuisines. The dough may also be fried after baking.

Related topics: Research

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